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Microbiological properties of copper dispersion obtained by cathodic deposition in the presence of acrylic acid
Abstract
Quantitative composition of organometallic electrodeposit obtained from the solution of 0.1 M CuSO4, 1.0 M H2SO4 and 0.2 M acrylic acid was determined by differential photometry. It was shown that the deposit contains copper complexes in an amount of 15% (wt.). Using the dispersion grain-size and microscopic analysis it was ascertained that the micropowder obtained by mechanical grinding of organometallic electrodeposit is more fine-grained and homogeneous compared with industrial or chemically obtained (by cementation with zinc) copper powders. Microbiological studies using clinical strain of microorganisms Staphylococcus aureus showed that the obtained copper-acrylate micropowder has bacteriostatic and bactericidal action. Suppression of bacteria’s vital activity in the interaction with the organometallic dispersion occurs from the first minute of exposure in contrast to the influence of industrial and chemically produced copper powders. This effect is related to the special structure of copper-acrylate powder.
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DOI: http://dx.doi.org/10.15421/081420
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