Microbiological properties of copper dispersion obtained by cathodic deposition in the presence of acrylic acid
Quantitative composition of organometallic electrodeposit obtained from the solution of 0.1 M CuSO4, 1.0 M H2SO4 and 0.2 M acrylic acid was determined by differential photometry. It was shown that the deposit contains copper complexes in an amount of 15% (wt.). Using the dispersion grain-size and microscopic analysis it was ascertained that the micropowder obtained by mechanical grinding of organometallic electrodeposit is more fine-grained and homogeneous compared with industrial or chemically obtained (by cementation with zinc) copper powders. Microbiological studies using clinical strain of microorganisms Staphylococcus aureus showed that the obtained copper-acrylate micropowder has bacteriostatic and bactericidal action. Suppression of bacteria’s vital activity in the interaction with the organometallic dispersion occurs from the first minute of exposure in contrast to the influence of industrial and chemically produced copper powders. This effect is related to the special structure of copper-acrylate powder.
Full Text:PDF (Українська)
Elechiguerra, J. L., Burt, J. L., Morones, J. R., Camacho-Bragado A., Gao X., Lara H. H., Yacaman M. J. Interaction of silver nanoparticles with HIV-1. J. Nanobiotechnology, 2005, 3:6.
Vargalyuk, V. F., Polonskyy, V. A., Orlenko, O. S. Quantum chemical study on the impact of olefin compounds electro-reduction process copper ions Nauk. Visn. Chern. Univ.: Khim, 2008, no. 399–400, p. 183–185. [in Ukrainian]
Fisher, E., Werner, G. Metal π-Complexes. New York: Elsevier publ. 1968, 264 p.
Cotton, A. Wilkinson, G. Advanced Inorganic Chemistry, 1969, V. 3, 593 p.
Vargalyuk, V. F., Polonskyy, V. A., Stets, N. V., Orlenko, O. S. Electrochemical formation and properties of copper precipitates obtained in the presence of acrylic acid. Visn. Dnipropetr. Univ.: Khim., 2011, vol. 19, no. 17, p. 13–17. [in Ukrainian]
Vargalyuk, V. F., Polonskyy, V. A., Stets, O. S. Properties micron copper electrodeposited from sulfate solutions containing acrylic acid or acrylamide Visn. Dnipropetr. Univ.: Khim., 2013, vol. 21, no. 20, p. 90–96. [in Ukrainian]
Electrolytic copper powder. Specifications. GOST (USSR standard) 4960-75, IPK Izdatelstvo standartov, 1975, 12 p. [in Russian]
Vnukov, O. O., Chyhyrynetsʹ, O. E., Roslyk, I. H., Halchenko, H. Yu., Kabatska V. V. Ukraine Patent no. 56876, 2010. [in Ukrainian]
Karyakyn, Yu. V., Anhelov I. I. Pure chemical substances. 1974, p. 237. [in Russian]
Hodakov, G. S., Yudkin, Y.P. Sedimentation analysis of superfine systems. 1981, p. 51. [in Russian]
Malkina, T. G., Podchajnova, V. H. Definition of large amounts of copper by differential photometry. Zh. Anal. Khim., 1964, vol. 19, no. 6, p. 668–670. [in Russian]
Vargalyuk, V. F., Polonskyy, V. A., Stets, O. S., Balalayev, O. K. Structure and properties of copper coatings electrodeposited from sulfuric acid solutions containing acrylic acid and acrylic amide. Ukr. Chem. J., 2013, vol. 79, no. 3, p. 51–58. [in Ukrainian]
This work is licensed under a Creative Commons Attribution 4.0 International License.
Journal of Chemistry and Technologies
eISSN: 2663-2942 | pISSN: 2663-2934
Address of founder:email@example.com
The journal publishes scientific works on conditions: Creative Commons Attribution 4.0 International License
Founder: Oles Honchar Dnipro National University